HST3000-BDCM-WB2 ADSL/VDSL Bonded and Copper (up to 30 MHz) with Broadcom Chipset
Saves money an reduces repeat faults with triple-play services testing capability in one Universal xDSL module that covers ADSL1, ADSL2, ADSL2+, VDSL2, Bonded ADSL, and Bonded VDSL
Provides critical ability to verify correct pair-bonding and provisioning
Provides investment protection in both CPE and DSLAM equipment, featuring the lates Broadcom chipset and compatible with the widest range of chipset manufacturers (Broadcom, Infineon, Ikanos/Conexant, and Texas Instruments)
Reduces troubleshooting time enabling users to segment single line performance issues of a bonded group and segment which pair requires further troubleshooting
Provides Hlog, and QLN graphing, which are key for identifying bridged tap, noise, and pair balance problems
Service providers face significant challenges when ramping up their networks to provide advanced triple-play services with the same or better quality than cable/ multiple switch operators (MSOs). A key success factor will be to cost-effectively increase bandwidth to subscribers for new IP video services over bonded asymmetric Digital Subscriber Line 2+/very high-speed Digital Subscriber Line 2 (ADSL2+/ VDSL2) while continuing to provide single line ADSL2+ service to subscribers without triple-play services capability. It is tempting to believe that the bonded two pair ADSL2+/VDSL2 connection can be tested similarly to single line ADSL connection, however, testing one pair at a time is insufficient. Internet Protocol television (IPTV) services require pristine xDSL service Layer 1 performance. Factors such as noise, crosstalk, pair imbalance, bridged taps, and other copper plant anomalies can be easily hidden when testing one pair at a time. Dual-pair bonded group testing is critical to ensuring that the service will be delivered to the subscriber with the best possible quality of service (QoS). Designed for the outside plant, the HST-3000 meets those challenges head-on.
Featuring the latest Broadcom Corporation chipset, the new service interface module (SIM) tests bonded-pair ADSL2+/VDSL2 by terminating both pairs of a bonded group. The Broadcom SIM also supports legacy ADSL1, ADSL2, ADSL2+, and VDSL2 in the same module, making it easy for technicians to switch between testing bonded and non-bonded services without having to swap modules. Further, the same module features dual tip/ring/ground interfaces for basic and advanced copper testing to further isolate copper pair problems. The new SIM provides additional testing power for field technicians who install and maintain access networks and high-bit-rate triple-play services, including IP Video.
The lightweight, rugged, and battery-operated HST-3000 with the Broadcom SIM cost-effectively scales to provide an all-in-one solution for field installation, maintenance, and troubleshooting across a wide range of triple-play service test applications.