Olympus OmniScan MX 32:128 Phased Array Flaw Detector
Condition: Refurbished / Calibrated
Warranty: 1 Year Warranty
Olympus OmniScan MX Phased Array Flaw Detector
With hundreds of units used throughout the world, the R/D Tech OmniScan MX is Olympus NDT’s most successful modular and portable phased array and eddy current array test unit. The OmniScan family includes the innovative phased array and eddy current array test units, as well as the eddy current and conventional ultrasound modules, all designed to meet the most demanding requirements of NDT. The OmniScan MX offers a high acquisition rate and powerful software features in a portable, modular mainframe to efficiently perform manual and automated inspections.
Rugged, Portable, and Battery-Operated
The OmniScan is built to work in the harshest field conditions. Its solid polycarbonatebased casing and rubber bumpers make it a rugged instrument that can withstand drops and shocks.
The OmniScan is so compact and lightweight (only 4.6 kg) that it can be carried easily and handled anywhere inside or outside. The OmniScan will run 6 hours with its two Li-ion batteries.
User Interface
The highly legible 8.4-inch real-time display (60-Hz A-scan refresh rate) with a SVGA resolution of 800 x 600 allows you to clearly see defects and details under any light conditions. A scroll knob and function keys make it easy to browse through and select functions. A mouse and a keyboard can also be plugged in for users looking for a more PC-like interface.
Modular Platform
The instrument is a modular platform that allows you to switch among its different test modules on location. The platform detects the new module and the technology supported so that the configuration and test environment are set automatically.
OmniScan Connector
The OmniScan connector has a probe ID feature that enables physical detection and recognition of the probe connected to the mainframe.
- Sets the probe to an appropriate frequency to prevent probe damage
- Sets C-scan resolution of ECA probes
- Loads the correct probe parameters
Typical Applications
Girth Weld Inspection
Olympus NDT has developed a circumferential weld inspection system based on the OmniScan PA for the oil and gas industry. This phased array system is qualified to inspect tube with diameters ranging from 48 mm to 1524 mm and thicknesses from 5 mm to 25 mm in compliance with ASME Boiler and Pressure Vessel Code Section V. The semiautomated system offers better inspection speed and detection, and makes the interpretation of the indications significantly easier.
Pressure Vessel Weld Inspection
The combination of time-of-flight diffraction (TOFD) and pulse-echo techniques means that the complete inspection is done in a single scan, significantly reducing the inspection time when compared to conventional raster scanning or radiography. Inspection results are available instantaneously, allowing you to spot a problem with the welding equipment and fix it right away. Based on our vast experience in the nuclear and petrochemical industries, this system includes all the functions that are needed for code-compliant weld inspections.
Scribe Marks Inspection with No Paint Removal
The Flight Standards Information Bulletin for Airworthiness (FSAW 03-10B), issued on November 2003, report damage along fuselage skin lap joints, butt joints, and other areas of several aircraft caused by the use of sharp tools used during paint and sealant removal.
The OmniScan allows the scribe marks inspection to be done without paint removal which is a huge time saver. The inspection is done in a single pass using 60º to 85º SW sector scans. OmniScan PA is now referenced in the Boeing NTM manuals, 737 NDT Manual, Part 4, 53-30-06, July 2005.
Aircraft Fuselage Inspection
The OmniScan ECA (eddy current array) provides the ability to detect hidden corrosion and cracks in multilayer structures. Currently, material loss of 10% of the lap splice thickness can be detected in aluminum at a depth of 0.2 in. Surface and subsurface cracks can be detected in the skin, at the fastener, or at the lap joint edges.
Ultrasound Inspection
Time-of-Flight Diffraction (TOFD) Testing
TOFD is a technique that uses two probes in pitch-and-catch mode. TOFD detects and records signals diffracted from defect tips for both detection and sizing. The TOFD data is displayed in a grayscale B-scan view. TOFD offers wide coverage and amplitudeindependent sizing compliant with the ASME-2235 code.
- One-line scan for full-volume inspection
- Setup independent of weld configuration
- Very sensitive to all kinds of defects and unaffected by defect orientation
Time-of-Flight Diffraction (TOFD) and Pulse-Echo Testing
While TOFD is a very powerful and efficient technique, it suffers from limited coverage resulting from two dead inspection zones: one dead zone is near the surface, the other is at the backwall.
OmniScan UT allows inspections simultaneously combining TOFD with conventional pulse echo. Pulse echo complements TOFD and covers the dead zones.
- TOFD inspection
- 45º pulse-echo for weld cap inspection on either sides of the weld
- 60º pulse-echo for weld root inspection on either sides of the weld
0-Degree Testing (Corrosion and Composite)
The 0-degree testing measures time-offlight and amplitude of ultrasonic echoes reflecting from the part into gates in order to detect and measure defects.
- C-scan imaging
- Full A-scan recording with C-scan postprocessing
Ultrasound Transducers
Olympus NDT offers thousands of transducers in standard frequencies, element diameters, and connector styles.
- Contact and immersion transducers
- Dual transducers
- Angle beam transducers and wedges
- Replaceable delay line transducers
- Protected-face transducers
- Normal incidence shear wave transducers
Phased Array Inspection
Phased Array Technology
Phased array technology generates an ultrasonic beam with the capability of setting beam parameters such as angle, focal distance, and focal point size through software. Furthermore, this beam can be multiplexed over a large array. These capabilities open a series of new possibilities. For instance, it is possible to quickly vary the angle of the beam to scan a part without moving the probe itself. Phased arrays also allow the replacement of multiple probes and even mechanical components. Inspecting a part with a variable-angle beam also maximizes detection regardless of the defect orientation, while optimizing signalto-noise ratio.
Benefits of Phased Arrays
Phased array technology offers the following capabilities:
- Software control of beam angle, focal distance, and spot size
- Multiple-angle inspection with a single, small, electronically-controlled multielement probe
- Greater flexibility for the inspection of complex geometry
- High-speed scans with no moving parts
Eddy Current Inspection
Eddy Current Technology
Eddy current (ECT) technology is a noncontact method for the inspection of metallic parts. In this technique, the probe, which is excited with an alternating current, induces eddy current in the part being inspected. Any discontinuities or material property variations that change the eddy current flow in the part are detected by the probe as a potential defect.
Over the years, probe technology and data processing have continuously progressed so that the eddy current technique is now recognized to be fast, simple, and accurate. This is why the technique is widely used in the aerospace, automotive, petrochemical, and power generation industries for the detection of surface or near-surface defects in material such as aluminum, stainless steel, copper, titanium, brass, Inconel®, and even carbon steel (surface defect only).
Benefits of Eddy Current
Eddy current offers the following capabilities:
- A quick, simple, and reliable inspection technique to detect surface and near-surface defects on conductive material
- Can be used to measure electrical conductivity of the material.
- Measurement of nonconductive coating
- Hole inspection with the use of highspeed rotating scanner and surface probe
Eddy Current Probes
Olympus NDT standard eddy current probes are available in different configurations:
- Bolt hole probes
- Surface probes, in various shapes and configurations
- Low-frequency Spot and Ring probes
- Sliding probes
- Wheel probes
- Conductivity probes
- Speciality probes made for specific applications
Specifications:
| Overall dimensions | 321 mm x 209 mm x 125 mm (12.6 in. x 8.2 in. x 5 in.) |
| Weight | 4.6 kg (10.1 lb) (including module and one battery) |
| Data storage | |
| Storage devices | CompactFlash® card, most standard USB storage device, or through fast Ethernet™ Internal 32 MB DiskOnChip® |
| Data file size | 160 MB |
| I/O ports | |
| USB ports | 3 |
| Speaker out | Yes |
| Microphone input | Yes |
| Video output | Video out (SVGA) |
| Video input | Video input (NTSC/PAL) |
| Ethernet™ | 10/100 Mb/s |
| I/O lines | |
| Encoder | 2-axis encoder line (quadrature, up, down, or clock/direction) |
| Digital input | 4 digital inputs TTL, 5 V |
| Digital output | 4 digital outputs TTL, 5 V, 10 mA |
| Acquisition on/off switch | Remote acquisition enable TTL, 5 V |
| Power output line | 5 V, 500 mA power output line (short-circuit-protected) |
| Alarms | 3 TTL, 5 V, 10 mA |
| Analog output | 2 analog outputs (12 bits) ±5 V in 10 kΩ |
| Pace input | 5 V TTL pace input |
| Display | |
| Display size | 8.4 in. (diagonal) |
| Resolution | 800 x 600 pixels |
| Number of colors | 16 million |
| Type | TFT LCD |
| Power supply | |
| Battery type | Smart Li-ion battery |
| Number of batteries | 1 or 2 (battery chamber accommodates two hot-swappable batteries) |
| Battery life | Minimum 6 hours with two batteries; minimum of 3 hours per battery in normal operation conditions |
| DC-in voltage | 15 V – 18 V (min. 50 W) |
| Environmental specifications | |
| Operating temperature | 0°C to 40°C (35ºC with 32:128 PA) |
| Storage temperature | –20°C to 70°C |
| Relative humidity | 0–95% non condensing. No air intake, splashproof design. |
| Ultrasound Module Specifications | |
| Overall dimensions | 244 mm x 182 mm x 57 mm (9.6 in. x 7.1 in. x 2.1 in.) |
| Weight | 1 kg (2.2 lb) |
| Connectors | LEMO® 00 (2, 4, or 8) |
| Pulser/Receiver | |
| Number of pulsers/receivers | 2, 4, or 8 |
| Pulser | |
| Pulse output | 50 V, 100 V, 200 V, 300 V ±10% (variable pulse width) |
| Pulse width | Adjustable from 30 ns to 1000 ns ±10%, resolution of 2.5 ns |
| Fall time | Less than 7 ns |
| Pulse shape | Negative square wave |
| Output impedance | Less than 7 Ω |
| Receiver | |
| Receiver gain range | 0–100 dB, by steps of 0.1 dB |
| Maximum input signal | 20 V p-p (screen at 128%) |
| Minimum sensibility | 200 µV p-p (screen at 128%) |
| Noise referred to input | 160 µV p-p (26 µV RMS) (128%) |
| Input impedance | 50 Ω |
| Input filter (100% bandwidth) | Centered at 1 MHz (1.5 MHz), centered at 2 MHz (2.25 MHz), centered at 5 MHz (4 MHz), centered at 10 MHz (12 MHz), centered at 15 MHz, centered at 20 MHz, 0.25–2.5 MHz, 2–25 MHz BB |
| Bandwidth of the system | 0.25–32 MHz (–3 dB) |
| Rectifier | Both, positive, negative |
| Mode | PE (pulse-echo), PC (pitch-and-catch), TT (through-transmission). In P-C mode the maximum number of pulsers equals the number of channels/2 |
| Smoothing | Digital |
| DAC | |
| Number of points | 16 |
| DAC range | Up to 40 dB |
| Maximum gain slope | 20 dB/µs |
| Data acquisition | |
| A-scan acquisition rate | 6000 A-scans/s (512-point A-scan) |
| Maximum pulsing rate | 1 channel at 12 kHz (C-scan) |
| Data processing | |
| Real-time averaging | 2, 4, 8, 16 |
| Gates | |
| Quantity | 3: I (synchro), A and B (measure) |
| Synchronization | I, A, B referenced on main bang, A and B referenced on gate I (postsynchronization) |
| Data storage | |
| A-scan recording (TOFD) | 6000 A-scans/s (512-point A-scan) (3 MB/s transfer rate) |
| C-scan type data recording | 12 000 (A1, A2, A3, T1, T2, T3) (3 gates) 12 kHz (lower frequency for corrosion mapping) |
| Data visualization | |
| Refresh rate | 60 Hz |
| Data synchronization | |
| On time | 1 Hz–12 kHz |
| On encoder | On 1 or 2 axes divided into 1 to 65,536 steps |
| Alarms | |
| Number | 3 |
| Conditions | Any logical combination of gates |
| Signal | Amplitude or TOF of gate A or B |
| Phased Array Module Specifications | |
| Overall dimensions | 244 mm x 182 mm x 57 mm (9.6 in. x 7.1 in. x 2.1 in.) |
| Weight | 1.2 kg (2.6 lb) |
| Connectors | 1 OmniScan connector for phased-array probes 2 BNC connectors (1 pulser/receiver, 1 receiver for conventional UT) (BNC not available on models 32:32 and 32:128) |
| Number of focal laws | 256 |
| Probe recognition | Automatic probe recognition and setup |
| Pulser/Receiver | |
| Aperture | 16 elements* |
| Number of elements | 128 elements |
| Pulser | |
| Voltage | 80 V per element |
| Pulse width | Adjustable from 30 ns to 500 ns, resolution of 2.5 ns |
| Fall time | Less than 10 ns |
| Pulse shape | Negative square wave |
| Output impedance | Less than 25 Ω |
| Receiver | |
| Gain | 0–74 dB maximum input signal 1.32 V p-p |
| Input impedance | 75 Ω |
| System bandwidth | 0.75–18 MHz (–3 dB) |
| Beam forming | |
| Scan type | Azimuthal and linear |
| Scan quantity | Up to 8 |
| Active elements | 16 |
| Elements | 128 |
| Delay range transmission | 0–10 µs in 2.5-ns increments |
| Delay range reception | 0–10 µs in 2.5-ns increments |
| Data acquisition | |
| Digitizing frequency | 100 MHz (10 bits) |
| Maximum pulsing rate | Up to 10 kHz (C-scan) |
| Acquisition depth | 29 meters in steel (L-wave), 10 ms with compression. 0.24 meter in steel (L-wave), 81.9 µs without compression |
| Data processing | |
| Number of data points | Up to 8000 |
| Real-time averaging | 2, 4, 8, 16 |
| Rectifier | RF, full wave, halfwave +, halfwave – |
| Filtering | Low-pass (adjusted to probe frequency), digital filtering (bandwidth, frequency range) |
| Video filtering | Smoothing (adjusted to probe frequency range) |
| Data storage | |
| A-scan recording (TOFD) | 6000 A-scans per second (512-point 8-bit A-scan) |
| C-scan type data recording | I, A, B, up to 10 kHz (amplitude or TOF) |
| Maximum file size | Limited by memory size |
| Data visualization | |
| A-scan refresh rate | Real-time: 60 Hz |
| A-scan refresh rate | Up to 40 Hz |
| Data synchronization | |
| On internal clock | 1 Hz – 10 kHz |
| On encoder | On 1 or 2 axes |
| Programmable time-corrected gain (TCG) | |
| Number of points | 16 (1 TCG curve per channel for focal laws) |
| Alarms | |
| Number of alarms | 3 |
| Conditions | Any logical combination of gates |
| Analog outputs | 2 |
Olympus OmniScan MX 32:128 Phased Array Flaw Detector
This phased array system is qualified to inspect tubes with diameters ranging from 48 mm to 1524 mm and thicknesses from 5 mm to 25 mm in compliance with ASME Boiler and Pressure Vessel Code Section V.
Includes Carrying Case & Accessories As Listed
BC# -L/T*
Refurbished Olympus OmniScan MX OmniScanMX Phased Array Flaw Detector Models On Sale Warranty Calibration Backed by The Best Service and Lowest Prices in the Industry.
- Olympus OmniScan MX 32:128 Phased Array Flaw Detector (BC# -L/T*)
- Battery Pack
- AC Adapter/Charger
- Power Cord
- User Manual On Cd-ROM
- Carrying Case (G)